【High Precision】"Contract Development and Processing Service for Edge/Surface Polishing of Circuit Boards"
The shape and surface accuracy of the substrate, as well as its strength, have improved! It also prevents damage and roughness in subsequent processes, leading to improved yield!
Our company is currently offering a "contract development and processing service for substrate edge/surface polishing" utilizing our extensive polishing know-how and precision polishing equipment and materials. Our unique polishing process achieves high precision in shape and surface accuracy, and by mirror-finishing the edge, we also enhance the strength of the substrate! This service provides numerous benefits, such as preventing damage in subsequent processes and reducing roughness at the outer edges that can easily occur during film formation, leading to improved yield and quality. 【Features】 ■ Edge processing available for diameters from φ8mm to φ450mm ■ Scrub cleaning possible after polishing ■ Well-equipped evaluation facilities! Quality checks and evaluations before and after processing are also supported ■ Capable of mirror finishing difficult-to-cut materials such as titanium and SiC *For more details, please download the catalog or contact us.
- Company：Mipox
- Price：Other
